Hong Leong, CLP Power hit the road to meet bond investors

© 2025 GlobalCapital, Derivia Intelligence Limited, company number 15235970, 4 Bouverie Street, London, EC4Y 8AX. Part of the Delinian group. All rights reserved.

Accessibility | Terms of Use | Privacy Policy | Modern Slavery Statement | Event Participant Terms & Conditions

Hong Leong, CLP Power hit the road to meet bond investors

Malaysia’s Hong Leong Bank started to meet investors this week, heading for a pair of update meetings that could lead to a bond in the near future.

Unlock this article.

The content you are trying to view is exclusive to our subscribers.

To unlock this article:

Request a Free Trial or Login
Gift this article