Stats ChipPac postpones HY bond as US dollar mart grinds to a halt

02 Jul 2008

Stats ChipPac, the Singaporean semiconductor tester, delayed its return to the high yield bond market as new issue volumes plummeted in a nervous, holiday-shortened week.

Stats finished a global roadshow last Friday (June 27) and had been expected to release guidance for a $500m to $1bn deal on Monday. However, poor conditions led the company to hold off in the hope that a better market window will appear next week.

Nerves over new record ...

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